Rigaku unveils DicifferX Microarea X

⏱Estimated reading time: 4 min

Introduction to the DicifferX Microarea Edition technology in materials analysis

Rigaku Corporation announced the introduction of the DicifferX Microarea Edition at JASIS 2026, an X-ray diffractometer specialized in studying materials at extremely fine-area levels as small as a few tens of micrometers.

This technology responds to the growing trend in the electronics industry toward miniaturizing components such as multilayer ceramic capacitors (MLCCs), which calls for precise analysis tools to verify the properties of these materials on a very small scale within a laboratory environment.

Technical challenges in measuring micro areas and how the device is designed to address them

Traditional measurements of fine areas involve several problems, the most important of which are the reduced X-ray intensity resulting from shrinking the beam size, and unwanted shifts in the irradiation position caused by slight mechanical deviations in the device.

The DicifferX Microarea Edition was specifically designed to address these problems by providing stability and precision in directing the X-ray beam toward areas measuring a few tens of micrometers, which improves the consistency and reliability of analysis results.

Main technical features of the device

1. Precise and stable X-ray beam guidance

The device relies on a stable X-ray source that reduces any deviation in the irradiation position, ensuring accurate targeting of the area to be analyzed and enhancing the credibility of the resulting diffraction data.

2. High-precision goniometer with axis-intersection correction

The system includes a high-precision multi-axis goniometer, where the software corrects positional differences that are mechanically unavoidable, thus maintaining high measurement accuracy even at the micrometer scale.

3. High-throughput concentrated beam with a high-brightness source and multilayer focusing mirror

A high-brightness X-ray source has been integrated with a multilayer focusing mirror to significantly increase beam intensity compared with conventional X-ray analysis devices. This increase in X-ray intensity helps improve measurement quality and reduce the time required to collect diffraction data.

Important mechanical point: Increasing X-ray beam intensity primarily helps enhance the accuracy and speed of measuring fine areas in miniaturized electronic materials.

4. Efficient data acquisition using a 2D detector

The device uses the HyPix-3000 two-dimensional detector with a wide detection area, allowing X-ray diffraction data to be collected efficiently from fine and small areas.

This system supports qualitative and quantitative evaluation of discolored areas or those containing foreign materials, in addition to enabling advanced measurements such as multi-point mapping, residual stress measurements, and pole figure measurements.

The importance of the DicifferX Microarea Edition for the mechanical and electronic industries

This advanced technology helps improve understanding of the properties of fine materials used in complex and miniaturized electronic device components, which is critical for reliability and industrial performance.

It also provides improved precision and stability that enable better control over the manufacturing processes of these components, and allows the study of problems related to mechanical deformation or residual stresses that may affect device durability.

Technical takeaway: Combining stability, software correction, and high X-ray intensity makes the DicifferX Microarea Edition an effective tool for examining and analyzing materials at a very high level of precision.

Conclusion

The DicifferX Microarea Edition represents a qualitative leap in the field of X-ray diffraction devices, as it meets the urgent need for analyzing materials in compact electronic components and provides new levels of precision and stability in industrial and technical laboratories.

Source: Rigaku Corporation


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